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? 2015 - 2016 microchip technology inc. ds00001888b-page 1 product features ? high performance 32-bit embedded controller ? cost effective solution ? small form factor ideal for embedded applications ? low power; 13.25ma in active mode ? system in deep sleep consumes 70a ? host interface via i 2 c ? 3.3-volt i/o ? package - 17mm x 17mm, 16-pin module sensor firmware ? sensor fusion firmware features include: - self-contained 9-axis sensor fusion - sensor data pass-through - fast in-use background calibration of all sen- sors and calibration monitor - magnetic immunity: enhanced magnetic dis- tortion, detection and suppression - gyroscope drift cancellation - fully calibrated ? easy to implement complete turnkey sensor fusion solution ? sensor power management ? sensors supported - bosch bmc150 geomagnetic sensor/accel- erometer - bosch bmg160 gyroscope hardware features the hardware features in the mm7150 module include the following: ?i 2 c controller - supports i 2 c bus speeds to 400khz - host interface supports slave operation ? low power modes target markets ? internet of things applications ? remote controls, gaming ? fitness monitoring ? applications requiring data from an accelerome- ter, magnetometer and gyroscope temperature ranges available ? industrial (-40c to +85c) ? commercial (0c to +70c) description the mm7150 motion module is a simple, cost-effective solution for integrating motion and positioning data into a wide range of applications. the module contains the ssc7150 motion coprocessor with integrated 9-axis sensor fusion as well as high performance mems tech- nology including a 3-axis accelerometer, gyroscope and magnetometer. all components are integrated, cal- ibrated and available on the module for pcb mounting. mm7150 motion module
mm7150 ds00001888b-page 2 ? 2015 - 2016 microchip technology inc. to our valued customers it is our intention to provide our valued customers with t he best documentation possible to ensure successful use of your microchip products. to this end, we will continue to im prove our publications to better suit your needs. our pub- lications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regarding this p ublication, please contact the marketing communications department via e-mail at docerrors@microchip.com . we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data sheet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. the last character of t he literature number is the version number, (e.g., ds30000000a is version a of document ds30000000). errata an errata sheet, describing minor operational differenc es from the data sheet and recommended workarounds, may exist for current devices. as device/documentation issues become known to us, we will publish an errata sheet. the errata will specify the revision of silicon and revision of document to which it applies. to determine if an errata sheet exists for a particular device, please check with one of the following: ? microchip?s worldwide web site; http://www.microchip.com ? your local microchip sales office (see last page) when contacting a sales office, please specify which devi ce, revision of silicon and da ta sheet (include -literature number) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products.
? 2015 - 2016 microchip technology inc. ds00001888b-page 3 mm7150 table of contents 1.0 mm7150 pinout ............................................................................................................. .................................................................. 4 2.0 mm7150 module ............................................................................................................. ................................................................ 7 3.0 mm7150 hid functions ...................................................................................................... ............................................................ 8 4.0 mm7150 host interface ..................................................................................................... ............................................................ 12 5.0 mm7150 firmware update .................................................................................................... ....................................................... 13 6.0 mm7150 references ......................................................................................................... ............................................................ 14 7.0 mm7150 performance ........................................................................................................ .......................................................... 15 8.0 electrical characteristics ................................................................................................ ............................................................... 16 appendix a: revision history .................................................................................................. ............................................................ 24 the microchip web site ........................................................................................................ .............................................................. 25 customer change notification service .......................................................................................... ..................................................... 25 customer support .............................................................................................................. ................................................................. 25 product identification system ................................................................................................. ............................................................ 26
mm7150 ds00001888b-page 4 ? 2015 - 2016 microchip technology inc. 1.0 mm7150 pinout the pinout of the mm7150 motion module is shown in the assembly drawing. 1.1 assembly drawing the assembly drawing is shown in figure 1-1 . figure 1-1: assembly drawing
? 2015 - 2016 microchip technology inc. ds00001888b-page 5 mm7150 1.2 recommended land pattern 0.00mm 1 16 2.80mm 4.00mm 6.08mm 6.53mm 8.61mm 9.08mm 11.16mm 11.62mm 13.70mm 15.04mm 17.84mm 0.00mm 2.80mm 4.00mm 6.08mm 6.53mm 8.61mm 9.08mm 11.16mm 11.62mm 13.70mm 15.04mm 17.84mm
mm7150 ds00001888b-page 6 ? 2015 - 2016 microchip technology inc. 1.3 pin descriptions the pin descriptions are provided in ta b l e 1 - 1 . table 1-1: pin descriptions pin number name type description 1 host_to_sh_wake i used to wake motion module from a sleep state. this signal must be driven high at least 11ms prior to sending any i 2 c traffic to the motion module. active high input. this pin should be connected to vdd through a 100k ? resistor. 11 host_to_sh_reset i reset input. used to reset the host i 2 c interface. this pin should be connected to vdd through a 100k ? resistor. 4 hidi2c_host_int o alert interrupt signal fr om motion module to host. used to tell host data from motion module is ready to be sent out. active low output. 15 hidi2c_host_clk iod i 2 c controller clock to host interface 16 hidi2c_host_dat iod i 2 c controller data to host interface 10 nc1 - this pin should be left unconnected 2 nc2 - this pin should be left unconnected 9 nc3 - this pin should be left unconnected 12 nc4 - this pin should be left unconnected 13 nc5 - this pin should be left unconnected 14 nc6 - this pin should be left unconnected 3 nc7 - this pin should be left unconnected 5 nc8 - this pin should be left unconnected 6 nc9 - this pin should be left unconnected 7 vdd pwr vdd supply 8 vss gnd vdd associated ground
? 2015 - 2016 microchip technology inc. ds00001888b-page 7 mm7150 2.0 mm7150 module the mm7150 motion module provides 9-axis sensor fusion th at includes a 3-axis accelerometer, a 3-axis gyroscope and a 3-axis magnetometer. the module has an i 2 c interface to the host, and supports hid over i 2 c. the module includes the bosch bmc150 geomagnetic sensor /accelerometer and bosch bmg160 gyroscope. 2.1 module block diagram the block diagram of the module is shown in figure 2-1 . 2.2 module features the mm7150 motion module provides self-contained 9-axis se nsor fusion. it supports fast in-use background calibration of all sensors and calibration monitor. magnetic immunity features provide enhanced magne tic distortion detection and suppression. the module also provides gyroscope drift cancellation. 2.3 calibration requirements user calibration is not requi red. the mm7150 motion module supports fast in -use background calibration of all sensors and calibration monitor. 2.4 other information to obtain the most recent and complete documentation for this module, including: - user's guide - board description - board schematics - source code - application examples - links to web seminars please refer to the web site: www.microchip.com/motion . figure 2-1: mm7150 module block diagram microchip ssc7150 motion coprocessor bosch bmg160 (gyro) bosch bmc150 (a+m) tps22929 power load vsensor hidi2c_device_clk hidi2c_device_dat hidi2c_host_dat hidi2c_host_clk hidi2c_host_int host_to_sh_wake d2_wake_up +3.3v gnd vdd vss (x2) avss host_to_sh_reset nc1 nc2 nc3 nc4 nc5 nc6
mm7150 ds00001888b-page 8 ? 2015 - 2016 microchip technology inc. 3.0 mm7150 hid functions the mm7150 responds to the standard hid pr otocol for sensors when used over i 2 c, defined in references [ 1 ] and [ 2 ]. the hierarchy of descriptors used in the hid protocol is as follows: the following sections described the descripto rs required for communicating with the mm7150: 3.1 hid descriptor 3.2 report descriptors report descriptors are composed of pieces of informa tion. each piece of info rmation is called an item. the hid class driver contains a parser used to analyze item s found in the report descriptor. the parser extracts infor- mation from the descriptor in a linear fashion. the parser collects the state of each kn own item as it walks through the descriptor, and stores them in an item state table. the item state table contains the state of individual it ems. from the parser's point of view, a hid class device looks like the following. table 3-1: hid descriptor format (i 2 c) field description size value whiddesclength length of hid descriptor uint 16 0x001e bcdversion version compliance. compli ant with version 1.00 uint 16 0x0100 wreportdesclength report descriptor length (3213 bytes) uint 16 0x0c8d wreportdescregister identifier to read report descriptor uint 16 0x0002 winputregister identifier to read input report uint 16 0x0003 wmaxinputlength input report is 13 bytes + 2 bytes length field uint 16 0x000d woutputregistert identifier to read output report uint 16 0x0000 wmaxoutputlength no output report uint 16 0x0000 wcommandregister identifier for command register uint 16 0x0005 wdataregister identifier for data register uint 16 0x0006 wvendorid vendor id uint 16 0x04d8 wproductid product id uint 16 0x0f01 wversionid version uint 16 0x7150 reserved reserved uint 32 0x0
? 2015 - 2016 microchip technology inc. ds00001888b-page 9 mm7150 the report descriptor is unlike other descrip tors in that it is not simply a tabl e of values. the length and content of a report descriptor vary depending on the number of data fiel ds required for the device?s report or reports. the report descriptor is made up of items that provide information about the device. the hid report for each sensor has two sections feature report and input report . the feature report for all the sen- sors is same. the following sections describe the feature re port and all input reports returned by the motion module.
mm7150 ds00001888b-page 10 ? 2015 - 2016 microchip technology inc. 3.2.1 feature report 3.2.2 3d accelerometer input report 3.2.3 compass input report table 3-2: feature report format field description size ucreportid report id uint 8 ucconnectiontype connection type uint 8 ucreportingstate reporting state uint 8 ucpowerstate power on state uint 8 ucsensorstate sensor state uint 8 uireportinterval reporting interval uint 16 usaccuracy accuracy uint 16 usresolution resolution uint 16 uschangesensitivity change sensitivity uint 16 smaximum maximum range int 16 sminimum minimum range int 16 minimumreportinterval minimum report interval supported uint16 sensordesc[6] sensor description, initialized ?mchpsf? int16 table 3-3: 3d accelerometer report format field description size ucreportid report id uint 8 ucsensorstate sensor state uint 8 uceventtype event type uint 8 saccelxvalue accelerometer x axis value int 16 saccelyvalue accelerometer y axis value int 16 saccelzvalue accelerometer z axis value int 16 ucshakedetectstate shake event detection uint 8 table 3-4: compass report format field description size ucreportid report id uint 8 ucsensorstate sensor state uint 8 uceventtype event type uint 8 sheadingcompensatedmag- neticnorthvalue magnetic north value int 16 sfluxxvalue magnetic field strength, x axis value int16 sfluxyvalue magnetic field strength, y axis value int16 sfluxzvalue magnetic field strength, z axis value int16
? 2015 - 2016 microchip technology inc. ds00001888b-page 11 mm7150 3.2.4 3d gyroscope input report 3.2.5 inclinometer input report 3.2.6 orientation input report table 3-5: 3d gyroscope report format field description size ucreportid report id uint 8 ucsensorstate sensor state uint 8 uceventtype event type uint 8 sgyroxvalue gyroscope x axis value int 16 sgyroyvalue gyroscope y axis value int 16 sgyrozvalue gyroscope z axis value int 16 ucshakedetectstate shake event detection uint 8 table 3-6: inclinometer report format field description size ucreportid report id uint 8 ucsensorstate sensor state uint 8 uceventtype event type uint 8 sincxvalue inclinometer x axis values int 16 sincyvalue inclinometer y axis value int 16 sinczvalue inclinometer z axis value int 16 table 3-7: orientation report format field description size ucreportid report id uint 8 ucsensorstate sensor state uint 8 uceventtype event type uint 8 sorixvalue orientation x axis value int 16 soriyvalue orientation y axis value int 16 sorizvalue orientation z axis value int 16 soriwvalue orientation w axis value int 16
mm7150 ds00001888b-page 12 ? 2015 - 2016 microchip technology inc. 4.0 mm7150 host interface 4.1 i 2 c the mm7150 can be connected to a host via the i 2 c interface. the i 2 c interface is compliant with the i 2 c standard described in [ 4 ], at speeds up to 400khz. above the transport layer, the protocol used by th e mm7150 is the same hid protocol used when communicating over usb. the mapping of hid over i 2 c is defined in reference [ 3 ]. the protocol and the interface, taken together, are co mpliant with windows 8/8.1 certification.
? 2015 - 2016 microchip technology inc. ds00001888b-page 13 mm7150 5.0 mm7150 firmware update the firmware in the mm7150 module may be updated at run time. see reference [ 5. ] for details.
mm7150 ds00001888b-page 14 ? 2015 - 2016 microchip technology inc. 6.0 mm7150 references 1. usb-sig, ?device class definition for human interface devices (hid). firmware sp ecification?, version 1.11, 6/27/01 2. usb-sig, ?hid usage table sensor page?, reques t hutrr39, http://www.usb.org/developers/hid- page/hutrr39b.pdf 3. microsoft corporation, ?hid over i 2 c protocol specification: device side?, version 1.00, 04/24/2012 4. nxp corporation, ?i 2 c-bus specification and user manual?, rev. 6, 04/04/2014 5. microchip technology inc., ?mm7150 motion module user's guide?, 2014
? 2015 - 2016 microchip technology inc. ds00001888b-page 15 mm7150 7.0 mm7150 performance table 7-1: performance parameters parameter typical accelerometer range 2g resolution 0.98mg accuracy 40mg magnetometer range x,y: 1300 t z: 2500 t resolution 0.3 t heading accuracy 3 compass range 0 to 360 resolution 1 accuracy 10 gyroscope range 2000/s resolution 0.061/s accuracy 5/s inclinometer range: pitch -180 to +180 range: roll -90 to +90 range: yaw 0 to +360 resolution 1 accuracy 5 orientation - quaternion range 1.0 resolution 0.001 accuracy 5
mm7150 ds00001888b-page 16 ? 2015 - 2016 microchip technology inc. 8.0 electrical characteristics this section provides an overview of the mm7150 electric al characteristics. additional information will be provided in future revisions of this document as it becomes available. absolute maximum ratings for the mm7150 devices are listed below. exposure to these maximum rating conditions for extended periods may affect device reliability. functional opera tion of the device at these or any other conditions, above the parameters indicated in the operation listin gs of this specificat ion, is not implied. absolute maximum ratings (see note 1) ambient temperature under bias (comme rcial temperature range)... .............. .............. .............. .............. . .0c t o +70c ambient temperature under bias (indust rial temperature range) ..............................................................-40 c to +85c storage temperature ............................................................................................................ .................. -65c to +150c voltage on v dd with respect to v ss ................................................................ .................................. ....... -0.3v to +4.0v voltage on any pin that is not 5v tolerant, with respect to v ss (note 3) ......................................... -0.3v to (v dd + 0.3v) voltage on any 5v tolerant pin with respect to v ss when v dd ? 2.3v (note 3) ................................. ....... -0.3v to +5.5v voltage on any 5v tolerant pin with respect to v ss when v dd < 2.3v (note 3) ................................. ....... -0.3v to +3.6v maximum current out of v ss pin(s) .......................................................................................................................3 00 ma maximum current into v dd pin(s) (note 2) ............................................................................................................300 ma maximum output current sunk by any i/o pin............ ......................................................................... .....................15 ma maximum output current sourced by any i/o pin.......... ........................................................................ ...................15 ma maximum current sunk by all ports......................... ..................................................................... ..........................200 ma maximum current sourced by all ports (note 2) ....................................................................................................200 ma note 1: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional op eration of the device at t hose or any other conditions, above those indicated in the operation listings of this specification, is not im plied. exposure to maximum rating conditions for extended periods may affect device reliability. 2: maximum allowable current is a function of device maximum power dissipation (see table 8-2 ). 3: see the ? pin list ? section for the 5v tolerant pins.
? 2015 - 2016 microchip technology inc. ds00001888b-page 17 mm7150 8.1 dc characteristics table 8-2: dc characteristics: operating/power-down current table 8-1: dc temperature and voltage specifications dc characteristics standard operat ing conditions: 2.3v to 3.6v (unless otherwise stated) commercial operating temperature 0c ? t a ? +70c industrial operating temperature -40c ? t a ? +85c param. no. symbol characteristics min. typ. max. units conditions operating voltage dc10 v dd supply voltage (note 2) 2.3 ? 3.6 v ? dc12 v dr ram data retention voltage (note 1) 1.75 ? ? v ? dc16 v por v dd start voltage to ensure internal power-on reset signal 1.75 ? 2.1 v ? dc17 s vdd v dd rise rate to ensure internal power-on reset signal 0.00005 ? 0.115 v/ ? s? note 1: this is the limit to which v dd can be lowered without losing ram data. 2: overall functional device operation at v bormin < v dd < v ddmin is tested, but not characterized. refer to parameter bo10 in table 8-5 for bor values. dc characteristics standard operat ing conditions: 2.3v to 3.6v (unless otherwise stated) commercial operating temperature 0c ? t a ? +70c industrial operating temperature -40c ? t a ? +85c parameter no. symbol typical max. units conditions operating/power-down current (note 1, 2) dc20 i dd 26.5 ma ? dc30 i avg 13.65 ma ? dc40 i idle 2.5 ma ? dc50 i pd 70 150 a 0c ? t a ? +70c dc50 i pd 120 180 a -40c ? t a ? +85c note 1: a device?s supply current is mainly a function of th e operating voltage and frequency, as well as tempera- ture. 2: the current measurements are as follows: ? operating current (i dd ): this is the peak active current value. ? average current (i avg ): this value represents an average current measurement of active and low power mode time intervals during operation measured over 1 second period. ? idle current (i idle ) this is the average idle current value when no sensor is actively providing environmental changes (and the device is not in power-down mode). ? power-down current (i pd ): this value is the current measured in power-down mode. th is is the sleep state entered when the host issues the set_power (sleep) command if the i 2 c host interface is used. wakeup from power-down mode requires the host_to_sh_wake pin if the i 2 c host interface is used.
mm7150 ds00001888b-page 18 ? 2015 - 2016 microchip technology inc. table 8-3: dc characteristics: i/o pin input specifications dc characteristics standard operatin g conditions: 2.3v to 3.6v (unless otherwise stated) commercial operating temperature 0c ? t a ? +70c industrial operating temperature -40c ? t a ? +85c param. no. symbol characteristics min. typical (1) max. units conditions v il input low voltage di10 i/o pins v ss ?0.2v dd v di18 sdax, sclx v ss ?0.3v dd vi 2 c disabled (note 4) di19 sdax, sclx v ss ?0.8vi 2 c enabled (note 4) v ih input high voltage di20 i/o pins not 5v-tolerant (5) 0.65 v dd ?v dd v (note 4,6) i/o pins 5v-tolerant (5) 0.65 v dd ?5.5v di28 sdax, sclx 0.65 v dd ?5.5vi 2 c disabled (note 4,6) di29 sdax, sclx 2.1 ? 5.5 v i 2 c enabled, 2.3v ? v pin ? 5.5 (note 4,6) i il input leakage current (note 3) di50 i/o ports ? ? + 1 ? av ss ? v pin ? v dd , pin at high-impedance di55 mclr# (2) ??+ 1 ? av ss ?? v pin ?? v dd note 1: data in ?typical? column is at 3.3v, 25c unless ot herwise stated. parameters are for design guidance only and are not tested. 2: the leakage current on the mclr# pin is strongly dependent on the applied voltage level. the specified levels represent normal operating conditions. higher le akage current may be measured at different input voltages. 3: negative current is defined as current sourced by the pin. 4: this parameter is characterized, but not tested in manufacturing. 5: see the ?pin list? section for the 5v-tolerant pins. 6: the v ih specifications are only in relation to externa lly applied inputs, and not with respect to the user- selectable internal pull-ups. external open drain input signals utilizing the internal pull-ups of the device are ensured to be recognized only as a logic ?high? internally to the device. for external ?input? logic inputs that require a pull-up source, to ensure the minimum v ih of those components, it is recommended to use an external pull-up resistor rather than the internal pull-ups of the device.
? 2015 - 2016 microchip technology inc. ds00001888b-page 19 mm7150 table 8-4: dc characteristics: i/o pin output specifications dc characteristics standard operating conditions: 2.3v to 3.6v (unless otherwise stated) commercial operating temperature 0c ? t a ? +70c industrial operating temperature -40c ? t a ? +85c param. symbol characteristic mi n. typ. max. units conditions do10 vol output low voltage i/o pins ??0.4vi ol ? 10 ma, v dd = 3.3v do20 v oh output high voltage i/o pins 1.5 (1) ?? vi oh ? -14 ma, v dd = 3.3v 2.0 (1) ?? i oh ? -12 ma, v dd = 3.3v 2.4 ? ? i oh ? -10 ma, v dd = 3.3v 3.0 (1) ?? i oh ? -7 ma, v dd = 3.3v note 1: parameters are characterized, but not tested. table 8-5: electrical characteristics: brown-out reset (bor) dc characteristics standard operat ing conditions: 2.3v to 3.6v (unless otherwise stated) commercial operating temperature 0c ? t a ? +70c industrial operating temperature -40c ? t a ? +85c param. no. symbol characteristics min. (1) typical max. units conditions bo10 vbor bor event on v dd transition high-to-low (2) 2.0 ? 2.3 v ? note 1: parameters are for design guidance only and are not tested in manufacturing. 2: overall functional device operation at v bormin < v dd < v ddmin is tested, but not characterized. table 8-6: internal voltage regulator specifications dc characteristics standard operating conditions: 2.3v to 3.6v (unless otherwise stated) commercial operating temperature 0c ? t a ? +70c industrial operating temperature -40c ? t a ? +85c param. no. symbol characteristics min. typical max. units comments d321 cefc external filter capacitor value 8 10 ? ? f capacitor must be low series resistance (1 ohm). typical voltage on the v cap pin is 1.8v.
mm7150 ds00001888b-page 20 ? 2015 - 2016 microchip technology inc. 8.2 ac characteristics and timing parameters the information contained in this section defines mm 7150 ac characteristics and timing parameters. figure 8-1: load conditions for device timing specifications table 8-7: capacitive loading requirements on output pins ac characteristics standard operating conditions: 2.3v to 3.6v (unless otherwise stated) param. no. symbol characteristics min. typical (1) max. units conditions do56 c io all i/o pins ? ? 50 pf do58 c b sclx, sdax ? ? 400 pf in i 2 c? mode note 1: data in ?typical? column is at 3.3v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. v dd/2 c l r l pin pin v ss v ss c l r l = 464 ? c l = 50 pf for all pins load condition 1 ? for all pins except osc2 load condition 2 ? for osc2
? 2015 - 2016 microchip technology inc. ds00001888b-page 21 mm7150 figure 8-2: power-on re set timing characteristics figure 8-3: external reset timing characteristics note 1: the power-up period will be extended if the power-u p sequence completes before the device exits from bor (v dd < v ddmin ). 2: includes interval voltage regulator stabilization delay. internal voltage regulator enabled v dd v por sy00 power-up sequence (note 2) internal voltage regulator enabled (t pu ) (t sysdly ) cpu starts fetching code (note 1) clock sources = (frc, frcdiv, frcdi v16, frcpll, ec, ecpll and lprc) sy02 mclr# (sy20) bor (sy30) t mclr t bor reset sequence cpu starts fetching code clock sources = (frc, f rcdiv, frcdiv16, frcpll , ec, ecpll and lprc) clock sources = (hs, h spll, xt, xtpll and s osc ) (t sysdly ) sy02 (t sysdly ) sy02
mm7150 ds00001888b-page 22 ? 2015 - 2016 microchip technology inc. table 8-8: resets timing figure 8-4: i 2 cx bus start/stop bits timing characteristics (slave mode) figure 8-5: i 2 cx bus data timing characteristics (slave mode) ac characteristics standard operat ing conditions: 2.3v to 3.6v (unless otherwise stated) param. no. symbol characteristics (1) min. typical (2) max. units conditions sy00 t pu power-up period internal voltage regulator enabled ?400600 ? s? sy02 tsysdly system delay period: time required to reload device configuration fuses plus sysclk (3) delay before first instruction is fetched. ? ??? s + 8 sysclk cycles ?? ? sy20 tmclr mclr# pulse width (low) 2 ? ? ? s? sy30 t bor bor pulse width (low) ? 1 ? ? s? note 1: these parameters are characterized, but not tested in manufacturing. 2: data in ?typ? column is at 3.3v, 25c unless othe rwise stated. characteriz ed by design but not tested. 3: sysclk is 48mhz is34 sclx sdax start condition stop condition is33 note: refer to figure 8-1 for load conditions. is31 is30 is30 is31 is33 is11 is10 is20 is26 is25 is40 is40 is45 is21 sclx sdax in sdax out note: refer to figure 8-1 for load conditions.
? 2015 - 2016 microchip technology inc. ds00001888b-page 23 mm7150 table 8-9: i 2 cx bus data timing requirements (slave mode) ac characteristics standard operating conditions: 2.3v to 3.6v (unless otherwise stated) param. no. symbol characteristics min. max. units conditions is10 t lo : scl clock low time 100 khz mode 4.7 ? ? s? 400 khz mode 1.3 ? ? s? is11 t hi : scl clock high time 100 khz mode 4.0 ? ? s? 400 khz mode 0.6 ? ? s? is20 t f : scl sdax and sclx fall time 100 khz mode ? 300 ns c b is specified to be from 10 to 400 pf 400 khz mode 20 + 0.1 c b 300 ns is21 t r : scl sdax and sclx rise time 100 khz mode ? 1000 ns c b is specified to be from 10 to 400 pf 400 khz mode 20 + 0.1 c b 300 ns is25 t su : dat data input setup time 100 khz mode 250 ? ns ? 400 khz mode 100 ? ns is26 t hd : dat data input hold time 100 khz mode 0 ? ns ? 400 khz mode 0 0.9 ? s is30 t su : sta start condition setup time 100 khz mode 4700 ? ns only relevant for repeated start condition 400 khz mode 600 ? ns is31 t hd : sta start condition hold time 100 khz mode 4000 ? ns after this period, the first clock pulse is generated 400 khz mode 600 ? ns is33 t su : sto stop condition setup time 100 khz mode 4000 ? ns ? 400 khz mode 600 ? ns is34 t hd : sto stop condition hold time 100 khz mode 4000 ? ns ? 400 khz mode 600 ? ns is40 t aa : scl output valid from clock 100 khz mode 0 3500 ns ? 400 khz mode 0 1000 ns is45 t bf : sda bus free time 100 khz mode 4.7 ? ? s the amount of time the bus must be free before a new transmission can start 400 khz mode 1.3 ? ? s is50 c b bus capacitive loading ? 400 pf ?
mm7150 ds00001888b-page 24 ? 2015 - 2016 microchip technology inc. appendix a: revision history table a-1: revision history revision section/figure/entry correction ds00001888b (01-26-16) industrial temp range added industrial temp range to data sheet updated ipd for industrial temp range ds00001888a (02-05-15) initial release
? 2015 - 2016 microchip technology inc. ds00001888b-page 25 mm7150 the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site con- tains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), te chnical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of semi- nars and events, listings of microchip sales offi ces, distributors and factory representatives customer change notification service microchip?s customer notification servic e helps keep customers current on microc hip products. subscribers will receive e-mail notification whenever there are changes, updates, revisi ons or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under ?support?, click on ?customer change notifi- cation? and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this docu- ment. technical support is available through the web site at: http://microchip.com/support
mm7150 ds00001888b-page 26 ? 2015 - 2016 microchip technology inc. product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . part no. (1) x device device: mm7150 (1) temperature range: blank = commercial (0c to +70c) i = industrial (-40c to +85c) sensor fusion firmware: ab1 = bosch 9-axis sensor fusion example: a) mm7150-ab1, bosch 9-axis sensor fusion, commercial temperature b) MM7150I-AB1, bosch 9-axis sensor fusion., industrial temperature series all package options are lead-free and rohs compliant. for rohs compliance and envi- ronmental information, please visit http://www.microchip.com/pagehandler/en- us/aboutus/ehs.html. note 1: these products meet the halogen maximum concentration values per iec61249-2-21. xxx firmware fusion sensor temperature range -
? 2015 - 2016 microchip technology inc. ds00001888b-page 27 mm7150 information contained in this publication re garding device applications and the like is provided only for your convenience and may be super- seded by updates. it is your responsibility to ensure that your application meets with your s pecifications. microchip makes no rep- resentations or warranties of any kind whether ex press or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fi tness for purpose . microchip disclaims all liability arising from this information and its use. use of micro- chip devices in life support and/or safety applications is entire ly at the buyer?s risk, and the buyer agrees to defend, indemn ify and hold harmless microchip from any and all damages, cl aims, suits, or expenses resulting from such use. no licens es are conveyed, impl icitly or otherwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, anyrate, dspic, flashflex, flexpwr, heldo, jukeblox, keeloq, keeloq logo, klee r, lancheck, link md, medialb, most, most logo, mplab, optolyze r, pic, picstart, pic32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered tradem arks of microchip technology incorporat ed in the u.s.a. and other countries. clockworks, the embedded control solutions company, ethersynch, hyper speed control, hyperlight load, intellimos, mtouch, precision edge, and quiet-wire are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, any capacitor, anyin, anyout, body com, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dynamic average matching, dam, ecan, ethergreen, in-circuit se rial programming, icsp, inter-c hip connectivity, jitterblocker, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem. net, pickit, pictail, puresilicon, righttouc h logo, real ice, ripple blocker, serial quad i/o, sqi, superswitcher, superswitcher ii, total endurance, tsharc, usbcheck, vari sense, viewspan, wiperlock, wireless dna, and zena are trademarks of mi crochip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchi p technology incorporated in the u.s.a. silicon storage technology is a regi stered trademark of microchip tech nology inc. in other countries. gestic is a registered trademarks of micr ochip technology germany ii gmbh & co. kg, a subsidiary of microc hip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2015 - 2016, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 9781522402169 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip pr oducts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microper ipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem by dnv == iso/ts 16949 ==
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